Thursday, March 19, 2009

Intel® Quad-Core Technology


Experience the latest and greatest next-generation Intel® quad-core technology providing outstanding performance and breakthrough energy efficiency. Delivering four complete execution cores within a single processor, Intel quad-core technology is the ideal choice when it comes to your high-performance computing needs. Designed from the ground up to provide the ultimate multitasking and multimedia experience, Intel quad-core technology-based PCs, workstations, and servers are the ideal choice for work, home, and play.

Intel® Multi-Core Technology for Embedded and Communications Applications


Intel® multi-core technology offers scalable and energy-efficient performance in a smaller footprint enabled by the advanced parallel processing of next-generation hafnium-based 45nm technology. With multiple execution cores within a single chip, these processors can operate at the same power level as previous generation single-core processors.
Ideal for communications and embedded systems where performance-per-watt has become increasingly critical, each execution core in an Intel multi-core processor is clocked slower than a single-core processor resulting in lower input voltage and greater performance.
Improved performance per watt enabled by 45nm Hi-k next generation Intel® Core™ microarchitecture, delivering improved transistor switching speed and reduced transistor gate leakage.
Backwards compatibility with Intel® Architecture-based processors so you can continue to utilize the 32-bit applications of today while adopting 64-bit applications for the future.
Assign different tasks to each execution core, with each functioning as a distinct processor, allowing you to dedicate multiple applications and operating systems (OSs) to a single execution core, unencumbered by tasks that would otherwise compete for CPU resources.

Intel® Virtualization Technology (Intel® VT) for Embedded Communications Applications

Hardware-assisted Intel® Virtualization Technology (Intel® VT)¹ provides greater flexibility and maximum system utilization by creation of multiple "Virtual Machines" (VM's) that run on a single hardware platform.
The ability to isolate OSs and application stacks provides a range of benefits for embedded and communications application developers:
Reduce operating and maintenance costs shrinking the overall footprint while eliminating redundant hardware
Protect against corruption with software failover and software migration
Protect previous development investments with legacy applications and new applications on the same hardware platform
Reduce platform overhead and support costs by consolidating onto isolated virtual machines that run both a real-time OS and general-purpose OS on the same device

Intel® Core™ Duo Processors


The Intel® Core™ Duo processor breaks new ground. Its dual-core technology rewrites the rules of computing, delivering optimized power efficient computing and breakthrough dual-core performance with amazingly low power consumption. Intel Core Duo processor is available in Intel's premium laptop platform, Intel® Centrino® processor technology.¹ It can also be found in select Intel® Core™2 processor with Viiv™ technology-based systems.²

Tuesday, March 10, 2009

Causing an Avalanche: The latest advance in Silicon Photonics


On December 7, Intel published world record results for a silicon-based photodetector in Nature Photonics, and we wanted to explain the results in a little more detail in this blog. Before launching into the “in’s and out’s” of avalanche photodetectors (APDs) though, it is important to provide some context for the work.
Several companies are active in the field of silicon photonics because they believe that silicon has an advantage in making the very low cost optical parts needed for large markets. These potentially include a very diverse set of applications including supercomputing, data center communications, consumer electronics, automotive sensors, and medical diagnostics just to name a few. Up until now, only a few silicon photonics products have been commercialized as companies have been working through the latter stages of the development and qualification processes. This looks set to change over the next few (≤3) years as several devices exit this pipeline and go on the market.
Intel has been doing research in this area for more than 5 years and has already reported on silicon modulators, silicon Raman lasers, and hybrid InP-Si lasers (view website). Last year we also published on a photodetector made from germanium and silicon that had a bandwidth of 31 GHz. The use of Ge is important because, unlike Si, it can efficiently detect light in the near infra-red which is the standard for communications. The drawback is that so much stress is developed in pure Ge films deposited on Si that defects are introduced near the Ge/Si interface. Careful design and processing is needed to minimize the impact of these defects on the electrical performance of the device, and this will be mentioned later.
We are now reporting on a different type of Ge/Si photodetector that has built-in amplification, which makes it much more useful in instances where very little light falls on the detector. It is called an avalanche photodetector because an avalanche process occurs inside the device. First, a negative and a positive charge (electrons and holes in semiconductor terminology) are created when the light strikes the detector. The electron is accelerated by an electric field until it attains a high enough energy to slam into a silicon atom and create another pair of positive and negative charges. Each time this happens the number of total electrons doubles, until this “avalanche” of charges are collected by the detection electronics. Click on the image below to see how this works. This amplification effect (called gain) is the key to the device, and it serves as the motivation for why anyone would try to do this in silicon and not just continue to use traditional InP-based APDs. The materials properties of silicon inherently led to lower noise and better performance in this avalanche process. Another reason relates to this bit economic trivia; an individual 10 Gb/s InP APD can sell for more than $200 currently and has a semiconductor area of roughly 400x400 m2. Even the much cheaper 1-2 Gb/s APDs used in fiber to the home (FTTH) still sell for $3-5.

Revolutionary mobile technologies


As our future becomes increasingly connected, Intel is developing advanced technologies that are enabling an entirely new line of laptops, Mobile Internet Devices (MIDs), and more.



Breakthrough mobility for notebooks

Designed for higher performance, advanced connectivity, and longer battery life, new Intel® Centrino® processor technology delivers a breakthrough notebook experience.+




Delivering extended broadband Internet that goes beyond Wi-Fi, Intel® WiMAX-enabled notebooks will provide freedom to connect in more places, and without being restricted to hotspots.


Teraflops Research Chip

Advancing Multi-Core Technology into the Tera-scale Era
The Teraflops Research Chip is the latest development from the Intel® Tera-scale Computing Research Program. This chip is Intel's first silicon tera-scale research prototype. It is the first programmable chip to deliver more than one trillion floating point operations per second (1 Teraflops) of performance while consuming very little power. This research project focuses on exploring new, energy-efficient designs for future multi-core chips, as well as approaches to interconnect and core-to-core communications. The research chip implements 80 simple cores, each containing two programmable floating point engines—the most ever to be integrated on a single chip. Floating point engines are used for accurate calculations, such as for graphics as well as financial and scientific modeling. In terms of circuit design, they are more complex than integer engines, which just process instructions.